High Performance Embedded Box IPC (MIC-7000)

High Performance Embedded Box IPC (MIC-7000)

The compact modular PC support i-module expansion to satisfy diverse application requirements. Modular computer reduces lead time for CTOS due to easy configuration and can be widely deployed for factory and machine automation.

Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)

Compact Fanless System with 8th Gen Intel® Core™ i CPU Socket (LGA 1151)

Compact Fanless System with Intel® 6th Gen Core™ i Processor

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